Displacement Sensor Using Diffused Type Semiconductor Strain Gages
نویسندگان
چکیده
منابع مشابه
Measurement of Thermal Expansion Coefficient Using Strain Gages
w w w. v i s h a y m g . c o m VMR-TC0513-0501 The thermal expansion coefficient is a very basic physical property which can be of considerable importance in mechanical and structural design applications of a material. Although there are many published tabulations of expansion coefficients for the common metals and standard alloys, the need occasionally arises to measure this propertay for a sp...
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The use of strain gages for low temperature thermal expansion measurements is increasing, due to it's convenience, and relative accuracy. The determination of thermal expansion with strain gages is complicated by "thermal output strain", a phenomena caused by the temperature dependence of the gage. If thermal output strain is properly compensated , strain gages may be used to measure thermal ex...
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The Tinius Olson Universal Testing machine (see Figure 1.1) is capable of loading a test specimen to a maximum load of 60,000 lb. The load applying section of this machine consists of three thick metal plates. The top and the bottom plates are rigidly connected together with thick tie rods. This assembly is connected on the bottom to a hydraulic cylinder which is contained within the base of th...
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ژورنال
عنوان ژورنال: Transactions of the Society of Instrument and Control Engineers
سال: 1981
ISSN: 0453-4654
DOI: 10.9746/sicetr1965.17.914